TUTORIAL LECTURES

• T1 Introduction to the partial element equivalent circuit method for the electromagnetic modeling of three dimensional geometries. A. E. Ruehli, IBM T.J. Watson Research Center, Yorktown Heights, NY, USA
• T2 Aspects of EMC at the equipment level. J. J. Goedbloed, Philips Research Laboratories, Eindhoven, Netherlands
• T3 Lightning electromagnetic effects on lines and cables. M. Ianoz, Swiss Federal Institute of Technology, Lausanne, Switzerland
  
  
WORKSHOPS

• W1 One year of experience with the EMC directive. M. C. Vrolijk, Philips Eindhoven, Netherlands
• 1W1 One year experience with the market surveillance in Germany and the system developed for that goal. G. Jeromin, Federal Office for Posts and Telecommunications, Mainz, Germany
• 2W1 Experiences of a competent body with one year EMC directive. J. D. Coenraads, Netherlands Measurement Institute, Delft, Netherlands
• 3W1 Analysis of the implementation of the EMC directive after one year by a European competent body. D. Hansen, D. Ristau, M. Loerzer, Euro EMC Service, Teltow, Germany
• 4W1 One year after the coming into force of EMC Directive: time to remove the EMC components? W. Hirschi, EMC Fribourg, Switzerland
• 5W1 The EMC directive: A manufacturer's perspective. S. P. Scott, IBM UK, Greenock, Scotland
• 6W1 One year of experience with the EMC directive. M. C. Vrolijk, Philips Eindhoven, Netherlands
  
  
• W2 EMC-adequate design of systems and components. W. John, Siemens Nixdorf Informationssysteme, Paderborn, Germany
• 1W2 Methods and tools to support the design of components and systems under EMC-constraints. W. John, SNI, Paderborn, Germany
• 2W2 EMC modelling: From IC to system. G. P. J. M. Maas, C. P. Stam, Philips Research Laboratories, Eindhoven, Netherlands
• 3W2 Computer aided prediction of crosstalk effects in CMOS integrated circuits. E. Sicard, INSA, Toulouse, France; M. Roca, UIB, Palma, Spain; F. Caignet, S. Delmas, INSA; J. Y Fourniols, Matra Marconi Space, Toulouse, France
• 4W2 The use of computer modelling software for analysing EMC shielding. C. R. I. Emson, Vector Fields, Kidlington; E. M. Deeley, Kings College, London, United Kingdom
• 5W2 The fast and efficient computation of capacitance coefficients of multiconductor structures for EMC purposes with a parallelized 3D-BEM. G. Mäder, F. Uhlmann, Technical University of Ilmenau, Germany
Poster presentations
EMC-effects on integrated circuits:
• 6W2 EMC-effects on integrated circuits. J. A. Catrysse, KHBO, Oostende, Belgium
• 7W2 Designflow to support the simulation, modelling and optimization of EMC-behaviour of input and output stages of CMOS and BICMOS integrated circuits. C. Foss, Thesys, Erfurt, Germany
• 8W2 Modeling of integrated circuits to support SI-analysis. O. Rethmeier, INCASES, Paderborn, Germany
• 9W2 Concepts of macromodel libraries. M. Schäder, INCASES, Paderborn, Germany
Signal integrity analysis and layout of PCB:
• 10W2 Automatic signal integrity analysis of complex systems. H. Holzheuer, University of Paderborn; O. Rethmeier, INCASES, Paderborn, Germany
• 11W2 Extraction of layout data as a basis for EMC-analysis of PCB. H. Woizeschke, R. Remmert, INCASES, Paderborn, Germany
• 12W2 Fast time domain simulation of reflection- and crosstalk noise on lossy interconnects. M. Ramme, H. Holzheuer, F. Sabath, University of Paderborn; E. Griese, SNI, Paderborn, Germany
• 13W2 A multi-method approach to PCB placement under EMC and thermal constraints. B. Stube, WIDIS Berlin; H. Schmidt, University of Paderborn, Germany
• 14W2 Rule-driven EMC-routing. D. Theune, INCASES; H. Schmidt, University of Paderborn, Germany
Radiation of systems and components:
• 15W2 Radiated emissions from a digital switching exchange due to PCBs, cables and small apertures. V. Costa, S. Caniggia, G. Marano, Italtel, Milan, Italy
• 16W2 EMI-modelling of PCB with respect to system design. G. Werrmann, J. Wolde, Alcatel SEL, Berlin, Germany
• 17W2 A hybrid method based on the multiconductor transmission line equation and the method of moments. F. Sabath, University of Paderborn; H. Garbe, University of Hannover, Germany
• 18W2 Simulation methods for radiation analysis of transmission line structures on PCB. S. Oeing, H. Eckardt, INCASES, Paderborn, Germany
• 19W2 Estimation of an electromagnetic emission ability. U. Keller, University of Paderborn, Germany
• 20W2 Sampling of PCB near fields - Calculation of far fields. W. Spreitzer, G. Fässler, F. M. Landstorfer, University of Stuttgart, Germany
Transmission line parameters:
• 21W2 Electrical characterization of anisotropic transmission line systems with a hybrid FEM/BEM method. M. Vogt, C-Lab, Paderborn, Germany
System and component design:
• 22W2 Improvement of the design process for development of high speed digital printed circuit boards. F. Hillebrand, H.-J. John, SNI, Paderborn, Germany
• 23W2 Advanced methods for system design under EMC constraints. T. Benz, ABB Corporate Research, Heidelberg; D. Frei, University of Paderborn; M. Petirsch, University of Karlsruhe; B. Akpebu, Technical University of Dresden, Germany
Design and analysis environments:
• 24W2 Integration methodologies for EMC analysis tools. R. Brüning, D. Pörtner, INCASES; W. John, SNI, Paderborn, Germany
• 25W2 A workflow-oriented environment to support EMC-adequate system design. W. John, SNI; W. Thronicke, University of Paderborn, Germany
Measurement techniques:
• 26W2 Comparison of EMC measurements in time and frequency domain by automotive examples. U. Reinhardt, K. Feurer, EMCtech, Waiblingen; T. Krauss, W. Köhler, K. Feser, University of Stuttgart, Germany
• 27W2 EMC test and measurement on printed circuit boards. M. Wehmeier, A. Marquordt, INCASES; V. Geneiss, W. John, SNI, Paderborn, Germany
• 28W2 Field sensor with optical conversion and link. J. Nedtwig, S. Banerjee, Daimler-Benz Aerospace, Ulm, Germany
  
  
• W3 Shielding Materials and Measuring Methods. J. Catrysse, KHBO, Oostende, Belgium
• 1W3 Shielding materials and enclosures: Basic shielding theory. J. A. Catrysse, KHBO, Oostende, Belgium
• 2W3 Designing with conductive plastic compounds for EMI-shielding. C. P. J. Borgmans, S. J. E. Eltink, DSM Performance Polymers, Sittard, Netherlands
• 3W3 Metal cabinets for EMI shielding. W. Nicolai, H. Holighaus, Rittal-Werk, Herborn, Germany
• 4W3 Metalized flexible materials and their use in gaskets, thermoforms and architectural shielding. J. De Schacht, Schlegel, Gistel, Belgium
• 5W3 Shielding materials and enclosures: Shielding measuring methods. J. A. Catrysse, KHBO, Oostende, Belgium
  
  
OPEN MEETINGS

• OE Electromagnetic noise and interference. International Union of Radio Science, URSI Commission E
• OE1 Report on the URSI Commission E scientific activities for the period 1994 - 1996. V. Scuka, Uppsala University, Uppsala, Sweden; M. Hayakawa, The University of Electro-Communications, Tokyo, Japan
• OE2 URSI Lille general assembly report. M. Hayakawa, The University of Electro-Communications, Tokyo, Japan
• OE3 High power electromagnetics. R. L. Gardner, Phillips Laboratory, Kirtland AFB, USA
• OE4 Rocket triggered lightning. Z-I. Kawasaki, Osaka University, Osaka, Japan; V. Cooray, Uppsala University, Uppsala, Sweden
• OE5 Effects of electromagnetic interference and transient disturbances on electronic components and PCBs. B. Demoulin, P. Degauque, Lille University, Villeneuve d'Ascq, France; V. Scuka, Uppsala University, Uppsala, Sweden
• OE6 Activity of URSI Commission E Working Group: E-7 on extraterrestrial and terrestrial meteorologico-electric environment with noise and chaos. H. Kikuchi, Nihon University, Tokyo, Japan
• OE7 Distributed-source transmission line theory for electromagnetic induction studies. D. H. Boteler, Geomagnetic Laboratory, Ottawa, Canada
  
  
• OS ISO Open Meeting on the International Space Systems EMC Standard. D. H. Trout, Marshall Space Flight Center, Huntsville, USA