Preliminary Program EMC Zurich '03






Organized by:

Sponsor:

Cooperating:

Honorary Chairman:

Organizing Committee:

Technical Program Committee:

Advisory Committee:

Location, Transportation, Climate:
Conference Registration:
Registration Fee:
Payments:
Symposium Record and Reprints:
Hotel Accommodation:
Further Information:
Organizing Committee address:


PROGRAM SUMMARY


Opening Ceremony
Sessions
Tutorial Lectures
Workshops
Open Meetings
Technical Exhibition
Reception:
Symposium Banquet
Authors Lunch
Farewell Party
Social Program - Tours
Technical Excursions
Press conference
Authors attention!

Sessions

TUESDAY, FEBRUARY 18

WEDNESDAY, FEBRUARY 19

THURSDAY, FEBRUARY 20


TUESDAY, FEBRUARY 18

A. Signal integrity and CAD modeling TUm
B. Radio noise TUm
C. EM field sensors TUm
D. Wired networks TUa
E. Intentional EMI TUa
F. Base stations and non-ionizing radiation TUa
G. Transmission lines and cables TUa

WEDNESDAY, FEBRUARY 19

H. Test chambers WEm
I. EMC modeling WEm
J. EMC innovation WEm
K. Emission and immunity testing WEa
L. Power and rail system and components WEa
M. Large chip and package EMC modeling WEa

THURSDAY, FEBRUARY 20

N. Automotive EMC THm
O. System EMC THm
P. Lightning and its effects THm
Q. Analysis of electrically large systems THa
R. Shielding THa
S. Instrumentation and measurement THa

TUTORIAL LECTURES

Chairman: Dr. F. Rachidi, Lausanne, Switzerland

Objective: The objective of the tutorial presentations is to provide overviews of the basics of certain important EMC topics for the purpose of assisting the attendees in their understanding of the material presented in the technical sessions.

T1. Modeling and Simulation of Electrical Interconnects, Packages, and Devices for High-Speed Applications
      (Monday, February 17, 11.00 - 13.00, room F 5)

Lecturer: Prof. F. Canavero, Politecnico di Torino, Turin, Italy; Prof. M. Nakhla, Carleton University, Ottawa, Canada; Dr. A. Ruehli, IBM Research Division, Yorktown Heights, NY, USA

Topics: With increasing demands for high signal speeds and circuit density, non-ideal behavior of interconnects and components have become more and more important for the performance and EMC compliance of modern electronic devices and systems.
This tutorial presents an overview of state-of-the-art techniques for electrical interconnect and packaging modeling, for their reduced-order equivalent circuit extraction, and for behavioral characterization of digital devices.
Applications cover a wide spectrum of implementation hierarchy, from chip level to printed circuit boards.

Lectures:

  1. Introduction and motivation (F. Canavero)
  2. Electromagnetic modeling of EIP´s (A. Ruehli)
  3. Model order reduction techniques (M. Nakhla)
  4. Macromodeling via system identification (F. Canavero)
  5. Behavioral models of digital devices (F. Canavero)

T2. Genetic Algorithms for EMC Applications
      (Monday, February 17, 14.00 - 16.00, room F 5)

Lecturer: Prof. G. Antonini and Prof. A. Orlandi, University of L´Aquila, Italy

Topics: Optimization problems often arise in EMC and EMI problems. The objective functions that are found in electromagnetic optimization problems are usually highly non-linear, stiff, multi-extremal and non-differentiable. In addition they are often computationally expensive to evaluate. Standard deterministic optimization methods have significant drawbacks when applied to this kind of problems. Genetic algorithms (GA´s) have shown appealing properties which make them suitable for electromagnetic optimization problems involving many parameters in a high-dimension multi-modal function domain. They are robust, stochastic search methods modeled on the principles and concepts of natural selection and evolution. The Tutorial will introduce the GA´s themselves and will provide the audience with guidelines for the implementation of successful GA´s. In particular GA´s operators are introduced and their implementation is discussed. Step-by-step procedures are given with associated code to offer the audience the opportunity to try GA´s. Some simple examples for EMC optimization problems are presented, giving hints and suggestions.

T3. EM Simulators ­ Theory and Practice
      (Monday, February 17, 9.00 - 17.00, room F 3)

Lecturer: Prof. W.J.R. Hoefer, University of Victoria, Canada; Dr. D.G. Swanson Jr., Forem, Amesbury, USA

Topics: The proliferation of computer tools for electromagnetic field analysis, design and optimization is having a profound effect on the working environment of EMC engineers. While most practitioners can use such tools after a certain period of training, many remain skeptical as to the trustworthiness of numerical results and hesitate about the limits, errors, and significance of the data generated. The key is to understand what goes on inside these tools and how they solve electromagnetic fields.
The purpose of this tutorial is to provide insight into the operating principles of electromagnetic simulators, and to show how these translate into their properties as engineering tools. The tutorial will be of benefit to:

T4. Reciprocity and EMC Measurements
      (Monday, February 18, 16.30 - 18.00, room F 5)

Lecturer: Dr. Jasper J. Goedbloed, Philips Research, Eindhoven, The Netherlands

Topics: Reciprocity theorems for electrical networks and electromagnetic fields allow us to better understand the mechanisms that play a role in EMC measurements or to facilitate EMC measurements.
This tutorial paper presents the theorems, their accompanying mathematical relations, and quite a number of practical applications that demonstrate the usefulness of these theorems. These applications, particularly of interest to experimentalists and EMC test-house engineers, cover the field of transfer function, filter and conversion measurements, the relevance of antenna factors, probe calibration, aspects of radiated emission in relation to compliance uncertainty and radiated immunity measurements. Also the reciprocity of shielding effectiveness and interference prediction are addressed.


WORKSHOPS

W1. Quantitative Data Comparisons
       (Wednesday, February 19, 9.00 - 12.30, room F 3)

Chairman: Dr. A. Duffy, De Montfort University, Leicester, UK

Contributors: Dr. D. Johns (Flomerics), A. Ruddle (MIRA), C. Jones (BAE Systems), Prof. R. Simpson (Simtronics), D. Coleby (De Montfort University)

Topics: Within the EMC community, the need to compare the results of measurements or predictions is widespread. Such comparisons could be for:

Traditionally, such comparisons have been carried out by-eye on graphically presented results or acceptability criteria have been based on heuristics determined from significant experience of the system being tested or designed. There does appear to be some movement towards identifying methods to compare such data quantitatively rather than just qualitatively, as such a comparison can minimise latent subjectivity.
The aims of this workshop are:
  1. To provide the EMC community with a forum for the discussion of current research on the topic.
  2. To identify the needs of the EMC community for quantitative comparisons.
  3. To identify application areas where such techniques would be well suited.
  4. To stimulate additional research on this topic and identify other approaches used by industry.

W2. Power Line Communications (PLC)
       (Wednesday, February 19, 14.00 - 17.30, room F 3)

Chairman: Dr. P.A. Beeckman, Philips Digital Systems Laboratory, Eindhoven, Netherlands

Contributors: Dr. P.A. Beeckman (Philips Digital Systems Laboratory), Dr. D. Hansen (Euro EMC Services), M. Stecher (Rohde & Schwarz), M. Bogers (EC), Prof. P.A. Brown (White Box Solutions), J.H. Stott (BBC), S. Roper (NSINE)

Topics: Power Line Communication (PLC) is a new technology that uses existing power network infrastructure for future broadband network services. PLC is considered as an opportunity for both access and in-home networks. The advantage of PLC is that existing power network infrastructure can be used. However, in Europe, EMC is considered as a key risk. Authorities in Germany and the UK require emission limits 20 to 40 dB below the current CISPR 22 emission limits, while the industry even want higher emission limits in order to make broadband services possible. A joint CENELEC/ETSI working group is dealing with the EMC standardization aspects of PLC.
The subjects covered by this workshop are:

W3. Emission Measurements with Alternative Methods
       (Thursday, February 20, 9.00 - 12.30, room F 3)

Chairman: Prof. H. Garbe, University of Hannover, Germany

Contributors: Prof. H. Garbe, Dr. P. Wilson, Dr. C. Holloway, Dipl.-Ing. M. Heidemann

Topics:

W4. GEMCAR European Project
       (Thursday, February 20, 14.30 - 17.30, room F 3)

Chairman: A. Ruddle, MIRA, Nuneaton, United Kingdom

Contributors: . Ruddle (MIRA), I. Hendrikx (Hevrox), Dr. X. Ferrieres, Dr. J.P. Parmentier (ONERA), A. Rubinstein, Dr. F. Rachidi (EPFL), Dr. S. Alestra, Dr. R. Perraud (EADS), Dr. M. Granstrom, M. Theander (Volvo TDC), A. Gunsaya (Ford Motor Company), F. Subaru, F. Druesne (CETIM), N. Whyman (QinetiQ)

Topics: GEMCAR (Guidelines for Electromagnetic Compatibility Modelling for Automotive Requirements) is a three-year collaborative research project supported by the EU under the Framework V programme "Competitive and Sustainable Growth". The aim of this project is to generate guidelines concerning applications and methods for modelling vehicle level automotive EMC issues. Nonetheless, these guidelines may well be of interest for other industries and applications. The purpose of this workshop is therefore to present and discuss the results of the project. The workshop will end with an opportunity for further questions and open discussion between the project partners and the audience.


Industrial Forums

Objective: Industrial Forums are a new presentation platform for EMC companies - in particular for the the Symposium Exhibitors - with the objective of providing the attendees some practical and industrial aspects of EMC activities. The planned forums are as follows:

F1. Industrial Forum 1
      (Tuesday, February 18, 10.30 - 12.30, room E1.2)

Chairman: Dr. G. Klaus
Contributions:

F1.1 Comparison of 100 Accredited German EMC Test Laboratories
J. Glimm, M. Spitzer, K. Muenter, R. Pape, Physik.-Techn. Bundesanstalt, Braunschweig; L. Dunker, R. Egner, DATech-Geschaeftsstelle, Frankfurt a.M., Germany

F1.2 An Analysis of Finnish EMC Market Surveillance and Suggestions for its Development
J. Rajamaeki, Safety Technology Authority of Finland/TUKES, Helsinki, Finland

F1.3 Electrical Design and Characterization Methodologies Applied in the Development of FlexBench - a Rapid Prototyping Equipment
F. De Pieri, M. Ferloni, M. Gaio, R. Gemelli, M. Grassi, C. Meani, M. Pavesi, V. Costa, Itatel, Settimo Milanese, Italy

F1.4 Reducing Errors due to Resonances in Radiated and Conducted EMC Testing
R.C. Marshall, Richard Marshall Ltd., Harpenden, United Kingdom

F2. Industrial Forum 2
      (Tuesday, February 18, 14.00 - 17.00, room E1.2)

Chairman: M. Nyffeler
Contributions:

F2.1 Comparison of Immunity and Emission Measurements in a Reverb Chamber
G. D´Abreu, ETS-Lindgren, Eura, Finland

Short Description: The purpose of this presentation is to demonstrate the efficiency and repeatability of performing immunity and emission measurements in two reverb chambers of greatly different sizes. The characterization data for both chambers will be presented in addition to the results of an immunity test on a device with known immunity and an emission measurement in the frequency band known to coincide with the emissions from the device. Some data will also be presented from tests done in a GTEM and OATS for reference.

F2.2 Innovation Process Management Towards a Sustainable Portfolio of Safe and Competitive Products
Dr. W.J. Borer, Electrosuisse and Neosys AG, Fehraltorf, Switzerland

Short Description: The innovation process will be described, consisting of the four phases strategy / portfolio, creation of product ideas, product development, and market introduction. Particular emphasis will be put on the aspects of total safety / risks, quality, environmental aspects, and product liability.

F2.3 Ergonomic Manuals for Sustainable Product Safety and Quality
M. Aellig, Electrosuisse, Fehraltorf, Switzerland

Short Description: TSM success manuals are based on a new concept by which ergonomic design risk analysis, standards conformity assessment, and usability tests are combined in order to obtain instructions for use (manuals) through which the user of a product / appliance gets easily understandable instructions for a safe and trouble-free use of his product / appliance.


Open Meetings

OA. Open Meetings of URSI Commission E
        International Radio Science Union (URSI)
        Commission E: Electromagnetic Noise and Interference
        (Monday, February 17, 16.30-18.30, GEP-Pavillon)
Organizer: Prof. P. Degauque, Chairman Commission E
Commission E WG (Chairmen):

OB. Exposure to GSM Radiation
        (Tuesday, February 18, 10.30 - 12.30, room F 3)
Organizer: Dr. G. Dürrenberger, Research Foundation on Mobile Communication, Zurich, Switzerland
Chairman: Prof. W. Bächtold, Swiss Federal Institute of Technology, Zurich, Switzerland
Contents: The session will present results from research projects funded by the Swiss Research Foundation on Mobile Communication. Contributions on: Impact of exposure to electromagnetic fields of type GSM on sleep-EEG and regional cerebral blood flow, cell-mortality in magnetite-producing bacteria exposed to GSM radiation, biological effects of low-level RF radiation on C. elegans and P. patens, Tradescantia micronucleus bioassay for detecting mutagenity of GSM fields, analysis of indoor RF-field distribution.

OC. IARU Open Meeting on EMC Problems Experienced and Caused by Radio Amateurs
        International Amateur Radio Union, Region 1, EMC Working Group
        (Tuesday, February 18, 17.30 - 18.30, GEP-Pavillon)
Chairman: C. M. Verholt, OZ8CY
Topics:


Social Program - Tours

Organizer: Mrs. E. Danieli, Zug, Switzerland

  • Tuesday, February 18: A welcome tea will be offered to all spouses and guests accompanying conference participants. Information about the tours will be given there.
    Meeting point: Fountain in the reception hall, 14.30.

    S1: Wednesday, February 19: Visit of the city of St. Gallen, the metropolitan centre of eastern Switzerland with its cultural attraction - the famous Abbey-District - which was included in the UNESCO list of culture world heritage in 1983. After lunch we see the 150 years old "Chocolate-Land" Maestrani. 8.30 - 16.15.

    S2: Thursday, February 20: Sightseeing tour to Engelberg with the scenic beauty of a high Alpine valley. We visit the Monastery and see cheese being made by hand in the Monastery cheese show factory. After lunch you have time for a short walk in the mountain village. 8.00 - 16.30.

    S3: Friday, February 21: Scenic bus journey through Central Switzerland, along Lake Lucerne. Short city tour of Lucerne and continuation to Kriens, where a cable car takes you to the top of Mt. Pilatus (2132 m / 7000 ft) into a mystical, white winter paradise. According to the legend, kind dragons used to inhabitate this mountain! Discover the Dragon Path and enjoy the spectacular panorama (if there is nice weather). Lunch on Mount Pilatus.

    S4: Friday and Saturday, February 21 - 22: Ride to Interlaken and Grindelwald, enjoy nature or even wintersports (all equipment may be rented). Overnight in Interlaken, scenic train journey over the Kleine Scheidegg to Lauterbrunnen and Mürren, top of Schilthorn (2970 m) with a fine meal in the revolving restaurant.

    Individual postconvention tours to excellent wintersport resorts may be organized either in advance (contact the Organizing Committee) or at the Symposium Information Desk. For the excursions S3 and S4 contact the Information Desk not later than Wednesday, Feb. 19, 13.00. Minimum participance 20 persons. Bus departure from Symposium building, underground passage. Please register as soon as possible (limited participance).


    Technical Excursions

    The following parallel visits are planned for Friday, February 21

    E1: Logitech SA, Romanel-sur-Morges
    Logitech is a leader of innovation and design in human computer interface devices. Visit of the product development laboratories for all kind of cordless devices, near to the Lake Geneva. Lunch is provided. Friday, Feb. 21, 8.00 - 18.00.

    E2: EM Microelectronic, a Swatch Group Company in Marin
    EM Marin is a semiconductor manufacturer that designs and produces ultra low power, low voltage, digital, analog and mixed ICs. Includes a visit of the production facilitiy. Lunch is provided. Friday, February 21, 8.00 - 17.00.

    Bus departure from Symposium building, underground passage. Since the number of places are limited, confirm your advance registration at the Information Desk until Wednesday, February 19, 13.00 !


    Technical Exhibition

    Exhibition Chairman: Dr. H. Kramer, IKT ETH , Zurich, Switzerland

    The exhibition area, located adjoining the session rooms, will be open daily (February 18 - 20) from 9.30 till 18.00 except on Thursday, when it closes at 16.30. An exhibition catalogue will be made available. Access to the exhibition is free.

    For information concerning the exhibition see the exhibiters web-page or contact the Organizing Committee

    
    PROVISIONAL LIST OF EXHIBITORS
    (As of October 1, 2002)
    
    AGILENT TECHNOLOGIES CO., USA
    ALBATROSS PROJECTS GMBH, Germany
    AMPLIFIER RESEARCH CORP., USA
    ARC SEIBERSDORF RESEARCH GMBH, Austria
    CST, Germany
    EM SOFTWARE & SYSTEMS - SA (PTY) LTD., South Africa
    EM TEST AG, Switzerland
    EMC PARTNER AG, Switzerland
    EMERSON & CUMING, Belgium
    EMITEC AG, Switzerland
    ETS-LINDGREN, USA
    IEEE EMC SOCIETY, USA
    JAQUIER EMC SERVICE SA/AG, Switzerland
    LECROY SA, Switzerland
    LUETHI ELEKTRONIK - FEINMECHANIK AG, Switzerland
    METEOLABOR AG, Switzerland
    MONTENA EMC SA, Switzerland
    NARDA SAFETY TEST SOLUTIONS GMBH, Germany
    PMM S.R.L., Italy
    PRANA, France
    ROHDE & SCHWARZ GMBH & CO KG, Germany
    SCHAFFNER EMC AG, Switzerland
    SIBALCO, W. SIEGRIST & CO. AG, Switzerland
    SIEPEL, France
    SIMLAB SOFTWARE GMBH, France
    SPITZENBERGER + SPIES GMBH, Germany
    TELEMETER ELECTRONIC GMBH, Switzerland