20th International Zurich Symposium on
Electromagnetic Compatibility

Proceedings EMC Zurich '01 Table of Contents

A. EMC protection

1A1 W. Wallyn, H. Rogier, E. Laermans, F. Olyslager, D. De Zutter, University of Gent, Belgium:
A new efficient MPIE formulation for modeling the shielding effectiveness of metallic enclosures.
2A2 Y. Kasashima, Kajima Technical Research Inst., Tokyo, Japan:
Theoretical analysis of frequency selective shielding films.
3A3 C. Weber, L. Jung, J.L. ter Haseborg, TU Hamburg-Harburg, Hamburg, Germany:
Characterization of inhomogenities in shielded multiconductor cables by evaluation of the coupling parameters and frequency domain reflectometry.
4A4 L. Sandrolini, U. Reggiani, University of Bologna; A. Massarini, University of Modena and Reggio Emilia, Modena, Italy:
Low-frequency multilayered magnetic shielding of circular loops.
5A5 M. Koch, Autoflug, Rellingen, Germany:
Applications of electrically conductive textiles.

B. Adverse effects of high power EM

6B1 W.A. Radasky, M. Messier, Metatech Corporation, Goleta, USA; M. Wik, FMV, Stockholm, Sweden:
Intentional electromagnetic interference (EMI) - Test data and implications.
7B2 V. Fortov, Yu. Parfenov, L. Zdoukhov, Russian Academy of Sciences; R. Borisov, S. Petrov, Moscow Power Institute; L. Siniy, Research Inst. Pulse Technic, Moscow, Russia:
A computer code for estimating pulsed electromagnetic disturbances penetrating into building power and earthing circuits.
8B3 I. Kohlberg, Institute for Defense Analyses, Alexandria; R.J. Carter, Operational Test and Evaluation, Office of Secretary of Defense, Washington DC, USA:
Some theoretical considerations regarding the susceptibility of information systems to unwanted electromagnetic signals.
9B4 C. Mojert, University of Hamburg; D. Nitsch, H. Friedhoff, J. Maack, F. Sabath, Scientific Inst. for Protection Techn., Munster; M. Camp, H. Garbe, University of Hannover, Germany:
UWB and EMP susceptibility of microprocessors and networks.
10B5 T.R. Gazizov, Tomsk State University, Tomsk, Russia:
Mitigation of parasitic effects in electronic systems for protection from intentional electromagnetic excitation.

C. Medical and biological issues

11C1 M. Okoniewski, University of Calgary, Canada; S. Hagness, University of Wisconsin-Madison, USA:
FDTD in bio-electromagnetics.
12C2 F. Moglie, V. Tassillo, University of Ancona, Italy:
Low frequency FDTD technique for evaluation of currents induced by a power line in a biological model of a body.
13C3 A.N. Volobuev, P.I. Romanchuk, Samara State Medical University, Samara, Russia:
Influence of a constant magnetic field and laser radiation on neurophysiological processes.
14C4 E. Bermani, S. Caorsi, University of Pavia; A. Massa, University of Trento, Italy:
Locally-constrained inverse scattering approach for electromagnetic field prediction.
15C5 M. Fernandez, M. Quilez, F. Silva, Univ. Politecnica Catalunya, Barcelona, Spain:
Near field EMI measurements in medical environments.

D. EMC in networks

16D1 M. D'Amore, M.S. Sarto, University of Rome "La Sapienza", Rome, Italy:
Experimental sensitivity analysis of the scattering parameters of wire harnesses for frequency-domain modelling.
17D2 S. Frei, Audi, Ingolstadt, Germany; R. Jobava, Tbilisi State University, Tbilisi, Georgia:
Coupling of inhomogeneous fields into an automotive cable harness with arbitrary terminations.
18D3 N. Ribiere-Tharaud, R. Chotard, S. Dop, PSA Peugeot Citroen, La Garenne-Colombes; M. Helier, D. Lecointe, J.-Ch. Bolomey, LSS-SUPELEC, Gif-sur-Yvette, France:
CDF and quantile: Relevant observables related to the common-mode current of a realistic cable bundle.
19D4 M.M. Al-Asadi, A.P. Duffy, De Montfort University, Leicester; K.G. Hodge, A.J. Wills, Brand-Rex, Glenrothes, United Kingdom:
A field-circuit approach for predicting electromagnetic coupling between communication channels using TLM and antenna theory.
20D5 G. Lucca, A. Bochicchio, M. Moro, Sirti S.p.a., Cassina de' Pecchi, Italy:
Electromagnetic interference on a telecommunication cable from a railway line: Comparison between calculations and measurements.
21D6 V. Rannou, F. Brouaye, M. Helier, W. Tabbara, LSS-SUPELEC, Gif- sur -Yvette, France:
Coupling of the field radiated by a mobile phone to a transmission line: A simple statistical and probabilistic approach.

E. Sensors and probes

22E1 E. Hirschmueller, G. Moenich, C. Schmidt, Technical University, Berlin, Germany:
Phase linearized log-periodic dipole antennas for undistorted pulse radiation and reception.
23E2 J. Glimm, K. Muenter, R. Pape, M. Spitzer, Phys.-Techn. Bundesanstalt, Braunschweig, Germany:
Measurement of gain factors of EMI test antennas at short distances: The "1-Antenna-Method" as a convenient alternative.
24E3 M. Schmidt, H.-P. Wolf, Univ. Applied Sciences Jena, Germany:
On calibration of field strength sensors and measuring systems: Methods of field generation and traceability.
25E4 Y. Tokano, H. Kobayashi, TOKIN Corp., Tsukuba; T. Miyakawa, Y. Houjyo, EMC Research Laboratories, Sendai, Japan:
A gigahertz-range micro optical electric field sensor.
26E5 P. Eskelinen, Finnish Defence Forces, Koskenkyla; H. Eskelinen, R. Suoranta, P. Silventoinen, Lapeenranta Univ. of Technology /LUT, Lapeenranta, Finland:
A DC-coupled transducer arrangement for the measurement of fast current transients.
27E6 F. Dudkin, V. Korepanov, Lviv Centre of Institute of Space Research, Lviv, Ukraine:
A new instrument for DC magnetic interference investigation.

F. EMC in power systems

28F1 A. Andreotti, L. Verolino, University of Napoli "Federico II", Naples; R. Araneo, S. Celozzi, University of Rome "La Sapienza", Rome, Italy:
Corona influence on lightning-induced overvoltages in MOV-protected multiconductor power lines.
29F2 M.S. Rahimian, S.H.H. Sadeghi, R. Moini, Amirkabir Univ. of Technology, Teheran, Iran:
A new method for the calculation of LEMP coupling with overhead lines in the presence of nonlinear loads.
30F3 X. Cui, L. Li, T. Lu, H. Yin, North China Electric Power University, Hebei, China:
Analysis of the potential distribution generated by a direct lightning strike in a 500kV substation.
31F4 D. Tabara, ABB Secheron, Geneva; M. Ianoz, Swiss Fed. Inst. of Technology, Lausanne, Switzerland:
EMC effects of switching operations in GIS. Modelling and experimental validation.
32F5 A. Orlandi, University of L'Aquila; S. Pignari, Politecnico di Milano, Italy:
Modal analysis of conducted EMI in three-phase power drive systems.
33F6 C.Y. Won, Y.C. Kim, J.H. Lee, J.J. Ahn, SungKyunKwan University, Suwon, South Korea:
The prediction of conducted EMI in PWM motor drive system.

G. Transients

34G1 J.L. ter Haseborg, T. Weber, TU Hamburg-Harburg, Hamburg, Germany:
Advances in measurement and simulation of transients.
35G2 G. Cerri, R. De Leo, V. Mariani Primiani, S. Pennesi, University of Ancona, Italy:
ESD response in parallel cables inside metallic enclosures.
36G3 P. Leuchtmann, R. Vahldieck, Swiss Fed. Inst. of Technology, Zurich; J. Sroka, Schaffner EMC, Luterbach, Switzerland:
Investigation of the electrostatic discharge (ESD) in the calibration setup (following IEC 61000-4-2).
37G4 J. Sroka, Schaffner EMC, Luterbach, Switzerland:
Target influence on the calibration uncertainty of ESD simulators.
38G5 V. Amoruso, M. Helali, F. Lattarulo, Politecnico di Bari, Italy:
Human-generated ESD: Investigation on the direct discharge to a victim.
39G6 W.G. Traa, Philips Semiconductors, Eindhoven, Netherlands:
An approach to improve ESD-generator calibration and the realisation of a simple discharge device for very wide band measurements.
40G7 D. Nitzschke, Energieversorgung Sachsen Ost, Dresden; H. Bauer, Technical University Dresden, Germany:
Simulation of transient disturbance voltages in substations using a combination of MoM and TLT.

H. Transmission lines

41H1 C.E. Baum, AFRL, Kirtland AFB, USA:
Extension of the BLT equation into time domain.
42H2 F. Schlagenhaufer, K. Fynn, A. Cantoni, University of Western Australia, Crawley, Australia:
Time domain analysis of lossy multiconductor transmission lines.
43H3 O. Gebele, H.-D. Bruens, TU Hamburg-Harburg, Hamburg, Germany:
Multiconductor transmission lines in a discretized environment.
44H4 N.V. Korovkin, S.V. Kotchetov, E.E. Selina, St. Petersburg State Technical University; S.V. Tkatchenko, Radio Research Institute (NIIR), Moscow, Russia; M. Ianoz, Swiss Fed. Inst. of Technology, Lausanne, Switzerland:
A model for a finite length transmission line considering skin and radiation effects.
45H5 H. Haase, J. Nitsch, Otto-v.-Guericke University, Magdeburg, Germany:
Full-wave transmission line theory (FWTLT) for the analysis of three-dimensional wire-like structures.
46H6 A. Maffucci, G. Miano, Universita di Napoli "Federico II", Naples, Italy:
Analysis of nonuniform transmission lines by means of the WKB method.
47H7 F. Brouaye, M. Helier, J.-Ch. Bolomey, LSS-SUPELEC, Gif-sur-Yvette, France:
Comparing height models of a single wire random transmission line.

I. Modeling large chips and packages

48I1 A. Ruehli, IBM T.J. Watson Res. Center, Yorktown Heights; A.C. Cangellaris, University of Illinois, Urbana, USA:
An overview of computer modeling for large EMC chip and package problems.
49I2 M. Leone, Siemens, Erlangen; H. Singer, TU Hamburg-Harburg, Hamburg, Germany:
Modeling guidelines for the simulation of transmission-line and printed-circuit board structures with the method of moments.
50I3 M.-I. Lai, J.-F. Kiang, S.-K. Jeng, National Taiwan University, Taipei, Taiwan
Multi-layered PCB power plane resonance analysis using method of lines.
51I4 M. Troescher, SimLab Software; H. Katzier, Siemens, Muenchen, Germany:
Efficient PEEC modeling of multi-layer boards and multi-chip modules.
52I5 J.R. Bergervoet, Philips Research Laboratories, Eindhoven, Netherlands:
Analytical modelling of radiated emission from long buslines in CMOS ICs.
53I6 T. Wittig, T. Weiland, Darmstadt University of Technology; F. Hirtenfelder, Computer Simulation Technology, Darmstadt; W. Eurskens, Infineon Technologies, Muenchen, Germany:
Efficient parameter extraction of high-speed IC-interconnects based on 3D field simulation using FIT.
54I7 Ch. Schuster, P. Regli, W. Fichtner, ISE Integrated Systems Engineering, Zurich, Switzerland:
Rigorous modeling of EMC and signal integrity issues at the board and package level using the extended FDTD method.
55I8 F. Paladian, P. Bonnet, University Blaise Pascal, Aubiere; M. Klingler, INRETS-LEOST, Villeneuve d'Ascq, France:
A frequency-domain prediction model using measured scattering parameters of electrically short lines to determine the per unit length parameter matrices of multiconductor transmission lines.

J. Lightning

56J1 R.E. Zich, Politecnico di Milano, Milan; G. Vecchi, Politecnico di Torino, Italy:
Lightning discharge on a branched channel.
57J2 C.E. Baum, AFRL, Kirtland AFB, USA:
Leader-pulse step-formation process.
58J3 G.A.C. Gomes, University of Colombo, Sri Lanka; V. Cooray, Uppsala University, Sweden:
Characteristics of cloud flashes.
59J4 A.P. Nickolaenko, National Academy of Science, Kharkov, Ukraine:
VLF sprite as a cloud-to-ionosphere discharge.
60J5 A. Andreotti, U. De Martinis, L. Verolino, University "Federico II", Naples; F. Delfino, P. Girdinio, University of Genoa, Italy:
A new method to identify return stroke characteristics.
61J6 F. Heidler, J. Wiesinger, W. Zischank, Fed. Armed Forces University Munich, Neubiberg, Germany:
Lightning currents measured at a telecommunication tower from 1992 to 1998.
62J7 B. Kordi, R. Moini, Amirkabir Univ. of Technology, Teheran, Iran; F. Rachidi, Swiss Federal Inst. of Technology, Lausanne, Switzerland:
Modeling an inclined lightning return stroke channel using antenna theory.
63J8 J.L. Bermudez, F. Rachidi, Swiss Federal Inst. of Technology, Lausanne; M. Rubinstein, Swisscom, Bern, Switzerland; M. Paolone, University of Bologna, Italy:
A method to find the reflection coefficients at the top and bottom of elevated strike objects from measured lightning currents.

K. Measurement techniques

64K1 W. Muellner, Austrian Research Center, Seibersdorf; A. Kriz, Technical University of Vienna, Wien, Austria:
Site attenuation of limited-size ground planes for vertical polarisation.
65K2 D. Gonzalez Rueda, M.J. Alexander, National Physical Laboratory, Teddington, United Kingdom:
EUT measurement comparison between different EM environments: FAR, OATS and GTEM cell.
66K3 K. Osabe, T. Komatsuzaki, Matsushita Communication Industrial, Yokohama; K. Tamura, Voluntary Control Council for Interference (VCCI), Tokyo, Japan:
A correlation test among measurement sites for radiated EMI using an actual machine and a stabilized power line impedance.
67K4 E. Zabala, J.E. Rodriguez, E. Perea, L. Rodriguez, LABEIN, Bilbao, Spain:
Simplified precompliance radiated EMI methods based on secondary source measurements.
68K5 H. Boss, Rohde & Schwarz, Munich, Germany:
Development of a novel digital quasi-peak detector for EMI-measurements.
69K6 S. Schattner, G. Bopp, T. Erge, Fraunhofer Institut, Freiburg, Germany; R. Fischer, H. Haeberlin, R. Minkner, Berner Fachhochschule, Burgdorf, Switzerland; R. Venhuizen, B. Verhoeven, KEMA T & D Power, Arnhem, Netherlands:
A new measurement technique ensuring the EMC of photovoltaic systems.
70K7 C. Keller, K. Feser, University of Stuttgart, Germany:
Fast emission measurement in time domain.
71K8 G. Cerri, R. De Leo, V. Mariani Primiani, University of Ancona, Italy:
A high frequency model of current probes for injection purposes.

L. Computer codes and validation

72L1 M. Ney, LEST/ENST de Bretagne, Brest, France:
Electromagnetic modeling in EMC.
73L2 P. Saguet, C. Golovanov, F. Ndagijimana, ENSERG, Grenoble, France:
The use of the transmission line matrix method for EMC applications.
74L3 V. Trenkic, R. Scaramuzza, KCC, Nottingham, United Kingdom:
Modelling of arbitrary slot structures using transmission line matrix (TLM) method.
75L4 H.G. Sasse, A.P. Duffy, De Montfort University, Leicester, United Kingdom:
Topics in the design of a parallel TLM solver.
76L5 S. Grivet-Talocia, F. Canavero, Politecnico di Torino, Italy:
A comparison of advanced time-domain solvers for multiconductor interconnects.
77L6 J. Nicolai, K.-H. Gonschorek, Dresden University of Technology, Dresden, Germany:
Application of spline-based expansion and weighting functions for an efficient analysis of thin-wire structures with small separation between the wires.
78L7 A.R. Ruddle, D.D. Ward, MIRA, Nuneaton; S.C. Pomeroy, Loughborough University, Loughborough, United Kingdom:
Comparison of analytical, numerical and measured results for simple wire networks near a ground plane.
79L8 F. Haslinger, BMW; B. Unger, M. Maurer, Siemens; M. Troescher, Simlab, Munich, Germany; R. Weigel, University of Linz, Austria:
EMC modeling of nonlinear components for automotive applications.

M. High frequency methods and analysis

80M1 K.-H. Gonschorek, A. Sturm, Dresden University of Technology, Dresden, Germany:
Analysis of arrangements containing cables as well as electrically small and large objects.
81M2 U. Jakobus, EM Software&Systems, Stellenbosch, South Africa:
Analysis of high-frequency EMC problems by an asymptotic hybrid method combining MOM with UTD or IPO.
82M3 G. Caccavo, G. Cerri, S. Chiarandini, V. Mariani Primiani, L. Pierantoni, P. Russo, University of Ancona, Italy:
Analysis of the electromagnetic field penetration into a loaded cavity by a hybrid method.
83M4 R. Araneo, S. Celozzi, University of Rome "La Sapienza", Rome; F. Schettino, L. Verolino, Universita di Napoli "Federico II", Naples, Italy:
On the solution of the wire-through-shield problem: The finite thickness configuration.
84M5 D. Leugner, H. Singer, TU Hamburg-Harburg, Hamburg, Germany:
Combination of moment methods and analytic techniques to treat apertures with depth.
85M6 H.-F. Harms, Thyssen Nordseewerke, Emden, Germany:
EMC field analysis in the vicinity of a large array antenna.
86M7 J.J. van Tonder, EM Software & Systems, Stellenbosch, South Africa; U. Jakobus, University of Stuttgart, Germany:
Full-wave analysis of arbitrarily shaped geometries in multilayered media.
87M8 M.Y. Koledintseva, University Missouri-Rolla, Rolla, USA:
Effective constitutive parameters of gyromagnetic absorbing mixtures for FDTD modeling.

N. Test chambers and cells

88N1 M.J. Alexander, S.H. Fletcher, J.C. Jee, National Physical Laboratory, Teddington, England:
Improved measurement of site attenuation in anechoic chambers.
89N2 M. Wiles, ETS Euroshield, Rochester, England; W. Muellner, Austrian Research Center Seibersdorf, Austria:
Fully anechoic room validation measurements to CENELEC prEN50147-3.
90N3 J.P. Kaerst, Ch. Groh, H. Garbe, University of Hanover, Germany:
Field mode properties of loaded TEM waveguides.
91N4 M. Heidemann, J.P. Kaerst, H. Garbe, University of Hanover, M. Koch, Autoflug, Rellingen, Germany:
Mode coupling theory for coaxial TEM-cells.
92N5 M. Schneider, G. Scheinert, F.H. Uhlmann, Technical University Ilmenau, Germany:
Investigation of the spherical TM and TE mode propagation in GTEM cells.
93N6 H.M. Looe, Y. Huang, University of Liverpool; B.G. Loader, M.J. Alexander, W. Liang, National Physical Laboratory, Teddington, England:
Investigation of the longitudinal field component inside the GTEM 1750.
94N7 D. Pouhè, Ericsson Eurolab Deutschland, Nuernberg; E. Nazli, G. Moenich, Technical University Berlin, Germany:
A new design model for foam absorber used in anechoic and semi-anechoic chambers: The inverse pyramid absorber.

O. PCBs in the GHz range

95O1 V. Adamian, B. Cole, P. Phillips, ATN Microwave, North Billerica; J. Knighten, N. Smith, R. Alexander, J. Fan, NCR Corporation, San Diego, USA:
Characterization of printed circuit board transmission lines at data rates above 1 GB/s using time domain characteristics derived from frequency domain measurements.
96O2 M. Xu, T. Hubing, J. Drewniak, T. Van Doren, R. DuBroff, University of Missouri-Rolla, Rolla, USA:
Modeling printed circuit boards with embedded decoupling capacitance.
97O3 J. Fan, J.L. Knighten, N.W. Smith, NCR Corporation, San Diego; J.L. Drewniak, University of Missouri-Rolla, Rolla, USA; A. Orlandi, University of L'Aquila, Italy:
Calculation of self and mutual inductances associated with vias in a DC power bus structure from a circuit extraction approach based on a mixed-potential integral equation formulation.
98O4 J. Nadolny, St. Sercu, FCI Electronics, Etters, USA:
Characterization and impact of skew on differential connector systems.
99O5 A. Goerisch, Siemens, Erlangen; G. Wollenberg, Otto-von-Guericke-University Magdeburg, Germany:
PEEC models for interconnection structures considering features of transmission lines.
100O6 O.M. Ramahi, Compaq Computer, Marlborough; B.R. Archambeault, IBM, Research Triangle Park, USA:
Full-wave analysis of delay lines.
101O7 C. Wang, X. Ye, J.L. Drewniak, University of Missouri-Rolla, Rolla; J.L. Knighten, D. Wang, R. Alexander, NCR Corporation, San Diego, USA:
FDTD modeling of EMI due to coupling from PCB traces to a heatspreader/heatpipe structure.

P. EMC innovation

102P1 G. Antonini, A. Orlandi, University of L'Aquila, Italy; A.E. Ruehli, IBM T.J. Watson Res. Center, Yorktown Heights, USA:
Fast iterative solution for the wavelet-PEEC method.
103P2 G. Antonini, University of L'Aquila, Italy:
Parallel computation of large EMC problems using the wavelet packet decomposition.
104P3 S.A. Emamghoreishi, R. Moini, S.H.H. Sadeghi, M.B. Menhaj, Amirkabir University of Technology, Teheran, Iran:
A novel neuro-based approach for predicting the location of cloud-to-ground lightning return strokes.
105P4 H. Roehm, J. Wilk, Univ. Federal Armed Forces, Hamburg, Germany:
Prediction of the electromagnetic near and far field using a neural network approach.
106P5 K. Aunchaleevarapan, K. Paithoonwatanakij, W. Khan-ngern, King Monkut's Institute of Technology, Bangkok; Y. Preampraneerach, NECTEC, Thailand; S. Nitta, Tokyo University of Agriculture & Technology, Tokyo, Japan:
Radiated EMI recognition and identification for PCB configurations and digital circuit using a neural network.
107P6 T.L. Ang, T. Sakusabe, T. Takahashi, N. Schibuya, Takushoku University, Tokyo; Y. Tarui, Jobu University, Gunma, Japan:
Automatic printed circuit board component placement with EMC consideration.
108P7 J.K. Lexau, J.E. Will, I.W. Jones, Sun Microsystems, Palo Alto, USA:
EM emissions of an asynchronous test chip.
109P8 L.M. Reyneri, F. Fiori, F. Gregoretti, Polytechnic of Turin, Italy:
Clock tree optimization to reduce EM emissions of VLSI circuits.
110P9 M. Tayarani, Y. Kami, University of Electro-Communications, Tokyo, Japan:
A qualitative analysis approach for an externally excited transmission line.

Q. EMC in communication systems

111Q1 D. Welsh, York EMC Services; A.D. Papatsoris, I. Flintoft, A. Marvin, University of York, England:
Investigation of likely increases in established radio noise floor due to widespread deployment of PLT, ADSL and VDSL broadband access technologies.
112Q2 K. Takaya, Y. Maeda, N. Kuwabara, NTT Lifestyle & Environmental Tech. Lab, Tokyo, Japan:
Determining the electromagnetic environment needed for high-quality, interference-free communication with a 2.4-GHz-band wireless LAN.
113Q3 P. Stenumgaard, Swedish Defence Research Establishment, Linkoping, Sweden:
Modeling radiated disturbances from information technology equipment for interference analysis on digital communication services.
114Q4 E.M. Lofsved, M. Broms, B.G. Johansson, Swedish Defence Res. Establishment, Linkoping, Sweden:
Man-made noise measurements considering digital communication services.
115Q5 F. Moulin, R. Tarafi, A. Zeddam, France Telecom, Lannion, France:
Impact of Impulse noise on the transmission quality of ADSL systems.
116Q6 M. Selivanov, N. Smirnov, Radio Research & Development Institute, Moscow, Russia:
Frequency sharing and EMC problems between TETRA trunking systems and GSM-400 land mobile networks.
117Q7 H. Kijima, Polytechnic University, Kanagawa; K. Taketani, Churitsu Electric, Tokyo; M. Zaima, K. Murakawa, H. Ohashi, NTT, Ibaraki, Japan:
Development of small-sized insulating transformers for telecommunications center buildings.

R. Reverberation chambers

118R1 P. Corona, G. Ferrara, Instituto Universitario Navale, Naples; M. Migliaccio, University of Cagliari, Italy:
Reverberating chambers and absorbers.
119R2 F. Hoeppe, P.-N. Gineste, Aerospatiale Matra, Suresnes; B. Demoulin, Universite de Lille, Villeneuve d' Ascq, France:
Numerical modelling for mode-stirred reverberation chambers.
120R3 M. Klingler, V. Deniau, INRETS-LEOST; L. Kone, B. Demoulin, Universite de Lille, Villeneuve d' Ascq, France; B. Kolundzija, University of Belgrade, Yugoslavia:
Characterization of direct electromagnetic coupling occurring in the vicinity of the lower modes in reverberation chambers.
121R4 L.R. Arnaut, National Physical Laboratory, Teddington, United Kingdom:
EUT reliability testing in mode-stirred reverberation chambers.
122R5 F.B.J. Leferink, D.J. Groot Boerle, F. Sogtoen, Thales Naval Systems, Hengelo; G. Heideman, W. van Etten, University of Twente, Enschede, Netherlands:
In-situ EMI measurements using a vibrating intrinsic reverberation chamber.
123R6 L. Musso, J. Bosse, V. Berat, Technocentre Renault, Guyancourt, France; F.G. Canavero, Politecnico di Torino, Torino, Italy:
Critical study of calibration techniques for a reverberation chamber.
124R7 M.O. Hatfield, Naval Surface Warfare Center, Dahlgren, USA:
Background and status of IEC standard 61000-4-21 on reverberation chambers.

S. Chip-level EMC

125S1 J. LoVetri, University of Manitoba, Winnipeg; T. Lapohos, J. Seregely, Def. Res. Establishment, Ottawa, Canada:
Investigation of the substrate's effect on the transient coupling to printed circuit boards.
126S2 S.B. Worm, Philips Research Laboratories, Eindhoven, Netherlands:
Comparison of workbench methods for testing RF emission properties of integrated circuits.
127S3 F.G. Canavero, I.A. Maio, I.S. Stievano, Politecnico di Torino, Turin, Italy:
Black-box models of digital IC ports for EMC simulations.
128S4 A. Nothofer, J.F. Dawson, S.M. Ward, A.C. Marvin, S.J. Porter, University of York, United Kingdom; J.E. Will, S. Hopkins, Sun Microsystems, Palo Alto, USA:
The effect of heatsink excitation and configuration on electromagnetic radiation from integrated circuits.
129S5 T. Shimamura, T. Douseki, M. Shinagawa, J. Yamada, NTT Telecommunications Energy Laboratories, Kanagawa, Japan:
A high-EMC-capable multi-threshold CMOS circuit and its verification with an EOS high-impedance probe.
130S6 V. Ricchiuti, Siemens ICN; A. Orlandi, G. Antonini, University of L'Aquila, Italy:
Buried capacitance technology for power bus decoupling on high speed digital PCB's.
131S7 M. Iwanami, T. Kuriyama, NEC Corp., Kawasaki, Japan:
Effect of magnetic loss on EMI suppression on power distribution systems of printed circuit boards.

Last update: January 26, 2009

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